Lightweight design and very high density, microComp? is an alternative to HD DSUB with superior characteristics,A flexible alternative to MIL-STD 83513 connectors.
Dismountable contacts for wiring flexibility
Lightweight composite materials
High vibration withstanding
屬性 | 數(shù)值 |
---|---|
觸點(diǎn)數(shù)目 | 25 |
性別 | 公插 |
主體定位 | 直向 |
安裝類型 | 通孔 |
節(jié)距 | 2.0mm |
端接方法 | 焊接 |
額定電流 | 2.5A |
外殼材料 | 聚合物 |
系列 | 8MCNF |
觸點(diǎn)電鍍 | 金 |
觸點(diǎn)材料 | 銅合金 |