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Capital Advanced Technologies 制造用于原型開發和制造的產品，是行業領導者。Surfboards? 表面貼裝試驗板和適配器可支持各式各樣的表面貼裝器件和電路配置。Uni-Sip? 試驗板為采用通孔元件的電路結構提供模塊化解決方案。這些產品組合在一起擴大了傳統試驗板技術的范圍，包括新元件技術并實現了更高效的互連性。
Capital Advanced Technologies today is a product of a diversified electronics manufacturing and process background acquired in over Thirty years of existence. Founded in 1980, The company began as a producer of high quality printed circuit boards for both the commercial and military markets. While Capital produced boards across the spectrum of types such as single-sided, double-sided, and multilayer A particular emphasis was placed on the utilization and development of techniques and processes that could enhance the base board performance. During this period Capital was producing boards that incorporated features such as printed polymer thick film ground planes and shields, Printed Resistors, Capacitors, Detectors, Transducers, Electroluminescent Lamps, and a variety of hybridization's of mixed polymer thick film and traditional printed circuit technology.
In the following decade Capital broadened its focus to include Design, Assembly, and test of electronics at the hybrid, board, and system levels with a particular emphasis on Surface Mount and Miniaturization technologies. In this period the company continued development of its surface mount and hybrid packaging processes with much success.
Today, While still producing a wide range of products for the electronics industry, Capital is also focused on the needs of engineers faced with the task of building breadboard or prototype circuits with traditional and Surface Mount technology as well as converting to Surface Mount from traditional through-hole. Capital now produces a line of products to address those needs as well as help the customer to transition to volume as the need arises. To that end Capital can provide a wide range of manufacturing services to help get your ideas to market.
